ER-094112

Sealing ring ITS50 C for SSF

manual

Technical data

Technical data for Sealing ring ITS50 C for SSF
Technologies
EDM sinking
EDM sinking
WEDM
WEDM
Chip-removing processes
Chip-removing processes

Downloads

Further information

Description
Aluminium anodized.
Mounting Interface
Prevents penetration of chips and dirt into the rapid action chuck during machining of EROWA electrode holders C.