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The semiconductor industry places the highest demands on cleanliness, precision and process reliability. Machining wafers, micro components or MEMS components requires not only excellent machines - but also precise clamping systems and intelligent automation that controls every step.
With EROWA Semiconductor solutions, you can automate your CNC processes - reliably, documented and with repeatability. Our clamping technology for micro components, software-controlled process monitoring and sensitive workpiece handling ensure reproducible quality at micrometer level.
Whether you are Machining silicon wafers, drilling micro holes or manufacturing MEMS structures - with EROWA Micromechanics Automation, every production step is controllable, scalable and traceable.
Our solutions are compatible with laser machines, milling centers and coordinate measuring systems - and ensure process-reliable micro production at an industrial level.